Technique and setup for diagnostics of p-n junction to case thermal resistance in high-power gallium nitride LEDs

Домашня сторінка
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Фізико-технічні та математичні науки
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Відділення фізики і астрономії
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Semiconductor Physics Quantum Electronics & Optoelectronics
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Semiconductor Physics Quantum Electronics & Optoelectronics, 2012, том 15
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Semicond. Physics Quantum Electronics & Optoelectronics, 2012, № 2
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Technique and setup for diagnostics of p-n junction to case thermal resistance in high-power gallium nitride LEDs

Sorokin, V.M. ; Konakova, R.V. ; Kudryk, Ya.Ya. ; Zinovchuk, A.V. ; Bigun, R.I. ; Kudryk, R.Ya. ; Shynkarenko, V.V.

Інший ID: PACS 66.70.Df, 85.60.Jb

URI: http://dspace.nbuv.gov.ua/handle/123456789/118301

Посилання: Technique and setup for diagnostics of p-n junction to case thermal resistance in high-power gallium nitride LEDs / V.M. Sorokin, R.V. Konakova, Ya.Ya. Kudryk, A.V. Zinovchuk, R.I. Bigun, R.Ya. Kudryk, V.V. Shynkarenko // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2012. — Т. 15, № 2. — С. 124-128. — Бібліогр.: 11 назв. — англ.

Підтримка: This work is part of the project 31/4.2.3.1/1833 of the Government Scientific & Technical Target Program “Development and introduction of energy-saving LED light sources and illumination systems based on them”.

Дата: 2012

Завантажень: 589

Technique and setup for diagnostics of p-n junction to case thermal resistance in high-power gallium nitride LEDs

Анотація:

We present a setup and procedure of studying p-n junction to case thermal resistance in high-power light-emitting diodes (LEDs) from their thermal relaxation. A set of LEDs mounted on a metal-core printed circuit board (MCPCB) were studied. The contributions to the total thermal resistance from a heavy heat sink, MCPCB, heat slug and LED chip are separated.

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