We present both theoretical and experimental temperature dependences of
contact resistivity ρс(Т) for ohmic contacts to the silicon n⁺
-n-structures whose n⁺
-layer
was formed using phosphorus diffusion or ion implantation. The ρс(Т) dependence was
measured in the 125–375 K temperature range with the transmission line method, with
allowance made for conduction in both the n⁺
-layer and n⁺
-n doping step.