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dc.contributor.author |
Sorokin, V.M. |
|
dc.contributor.author |
Konakova, R.V. |
|
dc.contributor.author |
Kudryk, Ya.Ya. |
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dc.contributor.author |
Zinovchuk, A.V. |
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dc.contributor.author |
Bigun, R.I. |
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dc.contributor.author |
Kudryk, R.Ya. |
|
dc.contributor.author |
Shynkarenko, V.V. |
|
dc.date.accessioned |
2017-05-29T16:34:47Z |
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dc.date.available |
2017-05-29T16:34:47Z |
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dc.date.issued |
2012 |
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dc.identifier.citation |
Technique and setup for diagnostics of p-n junction
to case thermal resistance in high-power gallium nitride LEDs / V.M. Sorokin, R.V. Konakova, Ya.Ya. Kudryk, A.V. Zinovchuk, R.I. Bigun, R.Ya. Kudryk, V.V. Shynkarenko // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2012. — Т. 15, № 2. — С. 124-128. — Бібліогр.: 11 назв. — англ. |
uk_UA |
dc.identifier.issn |
1560-8034 |
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dc.identifier.other |
PACS 66.70.Df, 85.60.Jb |
|
dc.identifier.uri |
http://dspace.nbuv.gov.ua/handle/123456789/118301 |
|
dc.description.abstract |
We present a setup and procedure of studying p-n junction to case thermal
resistance in high-power light-emitting diodes (LEDs) from their thermal relaxation. A
set of LEDs mounted on a metal-core printed circuit board (MCPCB) were studied. The
contributions to the total thermal resistance from a heavy heat sink, MCPCB, heat slug
and LED chip are separated. |
uk_UA |
dc.description.sponsorship |
This work is part of the project 31/4.2.3.1/1833 of the
Government Scientific & Technical Target Program
“Development and introduction of energy-saving LED
light sources and illumination systems based on them”. |
uk_UA |
dc.language.iso |
en |
uk_UA |
dc.publisher |
Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України |
uk_UA |
dc.relation.ispartof |
Semiconductor Physics Quantum Electronics & Optoelectronics |
|
dc.title |
Technique and setup for diagnostics of p-n junction to case thermal resistance in high-power gallium nitride LEDs |
uk_UA |
dc.type |
Article |
uk_UA |
dc.status |
published earlier |
uk_UA |
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