Анотація:
The review concentrates on the analysis of the RF hydrogen plasma effect on
thin-film metal-dioxide-silicon and silicon-dioxide silicon structures which are a modern
basis of micro- and nanoelectronics. The especial attention is paid to athermic
mechanisms of transformation of defects in dioxide, SiO₂-Si interface and SiO₂-Si
nanocrystal ones and thin layers of silicon; atomic hydrogen influence on the annealing
of vacancy defects and the implanted impurity activation in a subsurface implanted
silicon layer; and the hydrogen plasma effect on luminescent properties of nanostructured
light emitting materials.