Анотація:
We investigated temperature dependence of contact resistance of an
Au−Ti−Pd₂Si ohmic contact to heavily doped n⁺
-Si. The contact resistance increases with
temperature owing to conduction through the metal shunts. In this case, the limiting
process is diffusion input of electrons to the metal shunts. The proposed mechanism of
contact resistance formation seems to realize also in the case of wide-gap semiconductors
with high concentration of surface states and dislocation density in the contact.