Наукова електронна бібліотека
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періодичних видань НАН України
Backpressure at ECAP as a way for decreasing grain size and increasing ductility of UFG materials
Репозиторій DSpace/Manakin
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Backpressure at ECAP as a way for decreasing grain size and increasing ductility of UFG materials
Інший ID:
PASC: 81.40.-z
Посилання:
Backpressure at ECAP as a way for decreasing grain size and increasing ductility of UFG materials / G.I. Raab, N.A. Krasilnikov, R.Z. Valiev // Физика и техника высоких давлений. — 2003. — Т. 13, № 4. — С. 42-48. — Бібліогр.: 10 назв. — англ.
Підтримка:
The authors acknowledge Prof. A.K. Mukherjee (University of California, USA) for help to carry out the TEM research and D. Kolesnikov (High Pressure Research Centre, Poland) for the SEM work.
Дата:
2003
Переглядів:
631
Завантажень:
175
Анотація:
The investigation of the backpressure effect during equal-channel angular pressing (ECAP) on formation of ultrafine-grained (UFG) structure in pure copper has revealed that the increased hydrostatic pressure can contribute to formation of a more homogeneous microstructure with finer grains. ECAP with backpressure also exerts a favorable effect on strength and ductility characteristics of the UFG material.
