Перегляд за автором "Sypko, S.A."

Результати 1-2 з 2

Balance model for contactless chemo-mechanical polishing of wafers

Grigoriev, N.N.; Kravetsky, M.Yu.; Paschenko, G.A.; Sypko, S.A.; Fomin, A.V. (Semiconductor Physics Quantum Electronics & Optoelectronics, 2002)

We developed a physical model for polishing. It makes it possible to determine physico-chemical processes occurring at contactless chemo-mechanical polishing (CMP) of crystal surfaces. A balance equation for diffusion, ...
Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials

Kravetsky, M.Yu.; Sypko, S.A.; Fomin, A.V. (Semiconductor Physics Quantum Electronics & Optoelectronics, 2002)

On the basis of the balance model for convection-diffusion processes that occur during string chemical cutting (CC) of samples, we derive an analytical expression for the limiting CC rate at maximal use of etching agent. ...

Результати 1-2 з 2

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