Dislocation-diffusion mechanism of high-temperature healing of the cracks in crystals under loading

Домашня сторінка
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Фізико-технічні та математичні науки
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Відділення фізико-технічних проблем матеріалознавства
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Functional Materials
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Functional Materials, 2012, том 19
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Functional Materials, 2012, № 2
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dc.contributor.author	Boyko, Yu.I.
dc.contributor.author	Volosyuk, M.A.
dc.contributor.author	Kononenko, V.G.
dc.date.accessioned	2018-06-14T18:41:39Z
dc.date.available	2018-06-14T18:41:39Z
dc.date.issued	2012
dc.identifier.citation	Dislocation-diffusion mechanism of high-temperature healing of the cracks in crystals under loading / Yu.I. Boyko, M.A. Volosyuk, V.G. Kononenko // Functional Materials. — 2012. — Т. 19, № 2. — С. 245-250. — Бібліогр.: 10 назв. — англ.	uk_UA
dc.identifier.issn	1027-5495
dc.identifier.uri	http://dspace.nbuv.gov.ua/handle/123456789/135295
dc.description.abstract	The regularities of disc-like voids (cracks) healing in polycrystalline copper samples under conditions of uniaxial compression at 600°C were experimentally studied. The theory of crack healing by diffusion-dislocation mechanism was developed. Comparing the experimental data with the theoretical dependences has shown their complete correspondence, which is supported by agreement of the experimental Peierls threshold stress with literature data. The work is an important step for solving the general problem on mechanisms of stress relaxation near various stress concentrators in crystals.	uk_UA
dc.language.iso	en	uk_UA
dc.publisher	НТК «Інститут монокристалів» НАН України	uk_UA
dc.relation.ispartof	Functional Materials
dc.subject	Characterization and properties	uk_UA
dc.title	Dislocation-diffusion mechanism of high-temperature healing of the cracks in crystals under loading	uk_UA
dc.title.alternative	Дислокаційно-дифузійний механізм високотемпературного заліковування тріщин в кристалах під навантаженням	uk_UA
dc.type	Article	uk_UA
dc.status	published earlier	uk_UA