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Superconductor digital electronics: scalability and energy efficiency issues (Review Article)

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dc.contributor.author Tolpygo, S.K.
dc.date.accessioned 2018-01-16T13:33:06Z
dc.date.available 2018-01-16T13:33:06Z
dc.date.issued 2016
dc.identifier.citation Superconductor digital electronics: scalability and energy efficiency issues (Review Article) / Sergey K. Tolpygo // Физика низких температур. — 2016. — Т. 42, № 5. — С. 463-485. — Бібліогр.: 153 назв. — англ. uk_UA
dc.identifier.issn 0132-6414
dc.identifier.other PACS: 85.25.–j, 85.25.Am, 85.25.Cp, 85.25.Hv
dc.identifier.uri http://dspace.nbuv.gov.ua/handle/123456789/129109
dc.description.abstract Superconductor digital electronics using Josephson junctions as ultrafast switches and magnetic-flux encoding of information was proposed over 30 years ago as a sub-terahertz clock frequency alternative to semiconductor electronics based on complementary metal-oxide-semiconductor (CMOS) transistors. Recently, interest in developing superconductor electronics has been renewed due to a search for energy saving solutions in applications related to high-performance computing. The current state of superconductor electronics and fabrication processes are reviewed in order to evaluate whether this electronics is scalable to a very large scale integration (VLSI) required to achieve computation complexities comparable to CMOS processors. A fully planarized process at MIT Lincoln Laboratory, perhaps the most advanced process developed so far for superconductor electronics, is used as an example. The process has nine superconducting layers: eight Nb wiring layers with the minimum feature size of 350 nm, and a thin superconducting layer for making compact high-kinetic-inductance bias inductors. All circuit layers are fully planarized using chemical mechanical planarization (CMP) of SiO₂ interlayer dielectric. The physical limitations imposed on the circuit density by Josephson junctions, circuit inductors, shunt and bias resistors, etc., are discussed. Energy dissipation in superconducting circuits is also reviewed in order to estimate whether this technology, which requires cryogenic refrigeration, can be energy efficient. Fabrication process development required for increasing the density of superconductor digital circuits by a factor of ten and achieving densities above 10⁷ Josephson junctions per cm² is described. uk_UA
dc.description.sponsorship I am very grateful to all my colleagues at MIT Lincoln Laboratory who are involved with fabrication process development for superconductor electronics, especially to Vladimir Bolkhovsky and Scott Zarr, to Terry Weir and Alex Wynn for their part in device testing, and to Mark Gouker and Leonard Johnson for the discussions and management of the program. I would like to thank Vasili K. Semenov, Alex F. Kirichenko, Timur Filippov, Quentin Herr, Marc Manheimer, and D. Scott Holmes for useful discussions. My special thanks are to Daniel E. Oates for reading the manuscript and suggesting numerous improvements. This research is based upon work supported by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA), via Air Force Contract FA872105C0002. The views and conclusions contained herein are those of the author and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the ODNI, IARPA, or the U.S. Government. The U.S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright annotation thereon. uk_UA
dc.language.iso en uk_UA
dc.publisher Фізико-технічний інститут низьких температур ім. Б.І. Вєркіна НАН України uk_UA
dc.relation.ispartof Физика низких температур
dc.subject К 100-летию со дня рождения К.Б. Толпыго uk_UA
dc.title Superconductor digital electronics: scalability and energy efficiency issues (Review Article) uk_UA
dc.type Article uk_UA
dc.status published earlier uk_UA


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