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Effect of mechanical stress on operation of diode temperature sensors

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dc.contributor.author Borblik, V.L.
dc.contributor.author Shwarts, Yu.M.
dc.contributor.author Venger, E.F.
dc.date.accessioned 2017-06-14T07:14:52Z
dc.date.available 2017-06-14T07:14:52Z
dc.date.issued 2002
dc.identifier.citation Effect of mechanical stress on operation of diode temperature sensors / V.L. Borblik, Yu.M. Shwarts, E.F. Venger // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 3. — С. 322-327. — Бібліогр.: 16 назв. — англ. uk_UA
dc.identifier.issn 1560-8034
dc.identifier.other PACS: 07.07.D
dc.identifier.uri http://dspace.nbuv.gov.ua/handle/123456789/121331
dc.description.abstract Effect of uniaxial elastic strain (of moderate magnitude) on operation of n+- p-type diode temperature sensor made in silicon is considered theoretically. It is assumed that operating current and stress direction coincide with each other and with one of three main crystallographic directions [100], [110] and [111]. The cases of long and short diodes, compressive and tensile stresses are studied. It is shown that, under such conditions, two components of the piezojunction effect (namely: change in the minority carrier mobility and change in the intrinsic carrier concentration) act oppositely to each other. As a result, effect of longitudinal parasitic mechanical stress on indications of the silicon diode temperature sensors proves to be minimal in the direction of [100]-type [111]-type as it would be expected from rather than piezoresistivity of n-Si. uk_UA
dc.language.iso en uk_UA
dc.publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України uk_UA
dc.relation.ispartof Semiconductor Physics Quantum Electronics & Optoelectronics
dc.title Effect of mechanical stress on operation of diode temperature sensors uk_UA
dc.type Article uk_UA
dc.status published earlier uk_UA


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