Thermal simulation of heterogeneous structural components in microelectronic devices

dc.contributor.author	Gavrysh, V.I.
dc.contributor.author	Fedasyuk, D.V.
dc.date.accessioned	2017-05-31T05:34:02Z
dc.date.available	2017-05-31T05:34:02Z
dc.date.issued	2010
dc.identifier.citation	Thermal simulation of heterogeneous structural components in microelectronic devices / V.I. Gavrysh, D.V. Fedasyuk // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2010. — Т. 13, № 4. — С. 439-443. — Бібліогр.: 7 назв. — англ.	uk_UA
dc.identifier.issn	1560-8034
dc.identifier.other	PACS 74.25.fc
dc.identifier.uri	http://dspace.nbuv.gov.ua/handle/123456789/118738
dc.description.abstract	The steady state nonlinear problem of thermal conduction for isotropic strip with foreign rectangular inclusion that heats as an internal thermal source with heat dissipation has been considered. The methodology to solve this problem and its application for the specific dependence of the thermal-conductivity coefficients on temperature has been offered.	uk_UA
dc.language.iso	en	uk_UA
dc.publisher	Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України	uk_UA
dc.relation.ispartof	Semiconductor Physics Quantum Electronics & Optoelectronics
dc.title	Thermal simulation of heterogeneous structural components in microelectronic devices	uk_UA
dc.type	Article	uk_UA
dc.status	published earlier	uk_UA