Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials

Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials

Інші назви: Динамический коэффициент интенсивности напряжений для трещины продольного сдвига, находящейся на границе раздела и исходящей из круглых полостей в двух пьезоэлектрических материалах

Тема: Научно-технический раздел

УДК: 539.4

URI: http://dspace.nbuv.gov.ua/handle/123456789/173417

Посилання: Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials / D. Li, H.C. Wang, L.X. Wu // Проблемы прочности. — 2016. — № 1. — С. 58-68. — Бібліогр.: 13 назв. — англ.

Підтримка: The authors are grateful for the support of the National Science Fund for Young Scholars of Hebei Education Department (Q2012031).

Дата: 2016

Завантажень: 306

Dynamic Stress Intensity Factor for Interfacial Cracks of Mode III Emanating from Circular Cavities in Piezoelectric Bimaterials

Анотація:

This paper investigates dynamic stress intensity factors in piezoelectric bimaterials with interfacial cracks emanating from the circular cavities under steady SH-waves. The interfacial cracks are assumed to be permeable. Green functions for the experiment were constructed through complex variable and wave function expansion methods. Based on the crack-division and conjunction techniques, a series of Fredholm integral equations of the first kind were established to calculate the stress intensity of the crack tips. Direct numerical integration was used to solve the equations. Some numerical results were plotted to indicate the influence of the defect geometry, material constants, and SH-wave frequencies on dynamic stress intensity factors.

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